Shenzhen Han's Laser Technology Co., Ltd.

home products Laser Cutting Machines Laser Cutting Machine (DP-CX02-50)

Laser Cutting Machine (DP-CX02-50)

Payment & Shipping Terms:

Minimum Order Quantity:	1 Set/Sets
Delivery Time:	within 15 days
Payment Terms:	L/C,T/T

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Detailed Product Description

Laser Cutting Machine

·Product features

High precision and peeling quality, long longevity.
Fixed beam path, manual focusing, read beam indication.
Double beam paths.
Special desighed PC with diversified products for peeling.

·Applications & materials

Suitable for peeling of metal shielding-screen layer of inner data signal winding displacement of micro electronic products such as mobile phone, laptop, video recorder, digital camera, electronic dictionary.,etc.

Peeling of single wire, winding displacement, parallel wires, multi-layer wires.,etc.
Especially suitable for tinny data wire with diameter under 1mm.

·Technical data

Laser power:		50W
Laser wavelength:		1064nm
Cutting range ( X×Y):		200mm×60mm
Cutting wire diameter:		0.1-1.0mm
Cutting speed:		According to wire condition
Max. empty cutting speed:		200mm/s
Worktable positioning accuracy:		≤±0.01mm
Worktable bearing capacity:		15kg
Worktable accumulative error:		≤±0.01mm
Adjusting range of workpiece height:		10mm
Min. slot width		≤0.10mm
Min. facula size:		0.05mm
Max. cutting speed:		100mm/s
Positioning system:		By fixture
Suitable materials:		All kinds of wires with diametere under 1mm
Control system:		Googol card, IPC, image interface
Cooling system:		Han's water cooling system

*As products continue to update, please contact us for latest catalog.